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16-BIT 2:1 MUX/DEMUX SWITCH Integrated Device Technology, Inc. IDT74FST163233 ADVANCE INFORMATION FEATURES: * Bus switches provide zero delay paths * Extended commercial range of -40C to +85C * Low switch on-resistance: FST163xxx - 7 * TTL-compatible input and output levels * ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) * Available in SSOP, TSSOP and TVSOP DESCRIPTION: The FST163233 belongs to IDT's family of Bus switches. Bus switch devices perform the function of connecting or isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and the resistance between input and output ports is small. Without adequate bias on the gate-to-source junction of the FET, the FET is turned off, therefore with no VCC applied, the device has hot insertion capability. The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero. The FST163233 provides three 16-bit TTL-compatible ports that support 2:1 multiplexing. The SEL0,1 and TEST0,1 pins provide switch enable and mux select control as shown below. The A port can be connected to port 1B or port 2B or both ports 1B and 2B. FUNCTIONAL BLOCK DIAGRAM SEL0 TEST0 SEL1 TEST1 One of Eight Channels 0A1-8 2B1-8 1B1-8 1A9-16 One of Eight Channels 2B9-16 1B9-16 3512 drw 01 PIN DESCRIPTION Pin Names A, 1B, 2B SEL0-1, TEST0-1 I/O I/O I Description Buses A, 1B, 2B Control Pins for Mux and Switch Enable Functions 3512 tbl 01 The IDT logo is a registered trademark of Integrated Device Technology, Inc. COMMERCIAL TEMPERATURE RANGE (c)1996 Integrated Device Technology, Inc. AUGUST 1996 DSC-3512/1 1 IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE PIN CONFIGURATION 0A1 1B2 2B2 0A3 1B4 2B4 0A5 1B6 2B6 0A7 1B8 2B8 GND VCC 1A9 1B10 2B10 1A11 1B12 2B12 1A13 1B14 2B14 1A15 1B16 2B16 TEST0 TEST1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 SO56-1 SO56-2 SO56-3 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 1B1 2B1 0A2 1B3 2B3 0A4 1B5 2B5 0A6 1B7 2B7 0A8 GND VCC 1B9 2B9 1A10 1B11 2B11 1A12 1B13 2B13 1A14 1B15 2B15 1A16 SEL0 SEL1 3512 drw 02 ABSOLUTE MAXIMUM RATINGS(1) Symbol Description VTERM(2) Terminal Voltage with Respect to GND TSTG Storage Temperature IOUT Maximum Continuous Channel Current Max. -0.5 to +7.0 -65 to +150 128 Unit V C mA 3512 tbl 02 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condiitions for extended periods may affect reliability. 2. VCC, Control and Switch terminals. CAPACITANCE(1) Symbol CIN CI/O Parameter Control Input Capacitance Switch Input/Output Capacitance Switch Off Conditions(2) Typ. Unit 4 pF pF 3512 tbl 03 NOTES: 1. Capacitance is characterized but not tested 2. TA = 25C, f = 1MHz, VIN = 0V, VOUT = 0V FUNCTION TABLE SEL0 L H X SEL1 L H X TEST0 L L Function 0A to 1B 0A to 2B 0A to 1B and 0A to 2B Function 1A to 1B 1A to 2B 1A to 1B and 1A to 2B 3512 tbl 04 H TEST1 L L H SSOP/ TSSOP/TVSOP TOP VIEW 2 IDT74FST163233 16-BIT MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Commercial: TA = -40C to +85C, VCC = 5.0V 10% Symbol VIH VIL II H II L IOZH IOZL IOS VIK RON Parameter Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Voltage High Impedance Output Current (3-State Output pins) Short Circuit Current Clamp Diode Voltage Switch On Resistance(4) VCC = Max., VO = GND(3) VCC = Min., IIN = -18mA VCC = Min., VIN = 0.0V ION = 12mA VCC = Min., VIN = 2.4V ION = 8mA IOFF ICC Input/Output Power Off Leakage Quiescent Power Supply Current VCC = 0V, VIN or VO 4.5V VCC = Max., VIN = GND or VCC -- -- -- 0.1 1 3 A A 3512 tbl 05 Test Conditions(1) Guaranteed Logic HIGH for Control Inputs Guaranteed Logic LOW for Control Inputs VCC = Max. VCC = Max. VI = VCC VI = GND VO = VCC VO = GND Min. 2.0 -- -- -- -- -- -- -- -- -- Typ.(2) -- -- -- -- -- -- 300 -0.7 5 10 Max. -- 0.8 1 1 1 1 -- -1.2 7 15 Unit V V A A mA V NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25C ambient. 3. Not more than one output should be tested at one time. Duration of the test should not exceed one second. 4. Measured by voltage drop between ports at indicated current through the switch. 3 IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE POWER SUPPLY CHARACTERISTICS Symbol ICC ICCD Parameter Quiescent Power Supply Current TTL Inputs HIGH Dynamic Power Supply Current(4) Test Conditions(1) VCC = Max. VIN = 3.4V(3) VCC = Max. Outputs Open Enable Pin Toggling 50% Duty Cycle VCC = Max. Outputs Open 2 Select Pins Toggling (16 Switches Toggling) fi = 10MHz 50% Duty Cycle Min. -- -- Typ.(2) 0.5 30 Max. 1.5 40 Unit mA A/ MHz/ Switch mA VIN = VCC VIN = GND IC Total Power Supply Current (6) VIN = VCC VIN = GND VIN = 3.4 VIN = GND -- 4.8 6.4 -- 5.3 7.9 NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25C ambient. 3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND. 4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations. 5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. 6. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC + ICC DHNT + ICCD (fiN) ICC = Quiescent Current ICC = Power Supply Current for a TTL High Input (VIN = 3.4V) DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at DH ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fi = Input Frequency N = Number of Switches Toggling at fi All currents are in milliamps and all frequencies are in megahertz. 3512 tbl 06 SWITCHING CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Commercial: TA = -40C to +85C, VCC = 5.0V 10% Symbol tPLH tPHL tBX tPZH tPZL tPHZ tPLZ |QCI| |QDCI| Description Data Propagation Delay A to B, B to A(3,4) Switch Multiplex Delay SEL to A Switch Turn on Delay SEL, TEST to B Switch Turn off Delay SEL, TEST to B Charge Injection, Typical(5,7) Charge Injection, Typical(6,7) Condition(1) CL = 50pF RL = 500 Min.(2) -- 1.5 1.5 1.5 -- -- Typ. -- -- -- -- 1.5 0.5 Max. 0.25 6.5 6.5 7 -- -- Unit ns ns ns ns pC 3512 tbl 07 NOTES: 1. See test circuit and waveforms. 2. Minimum limits guaranteed but not tested. 3. This parameter is guaranteed by design but not tested. 4. The bus switch contributes no propagation delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 2.5ns for 50pF load. Since this time is constant and much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay on the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. 5. Measured at switch turn off, load = 50 pF in parallel with 10 M scope probe, VIN = 0.0 volts. 6. Measured at switch turn off through bus multiplexer, (e.g.- A to 1B = >A to 2B), load = 50 pF in parallel with 10 M scope probe, VIN at A = 0.0 volts. Charge injection is reduced because the injection from the turn off of the A to 1B switch is compensated by the turn on of the A to 2B switch. 7. Characterized parameter. Not 100% tested. 4 IDT74FST163233 16-BIT MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE TEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTS V CC 500 VIN Pulse Generator RT D.U.T. 50pF CL 3512 lnk 03 SWITCH POSITION 7.0V Test Open Drain Disable Low Enable Low All Other Tests Switch Closed Open VOUT 500 3512 lnk 08 DEFINITIONS: CL= Load capacitance: includes jig and probe capacitance. RT = Termination resistance: should be equal to ZOUT of the Pulse Generator. SET-UP, HOLD AND RELEASE TIMES DATA INPUT TIMING INPUT ASYNCHRONOUS CONTROL PRESET CLEAR ETC. SYNCHRONOUS CONTROL PRESET CLEAR CLOCK ENABLE ETC. tSU 3V 1.5V 0V 3V 1.5V 0V 3V 1.5V 0V 3V 1.5V 0V 3512 lnk 04 PULSE WIDTH tH LOW-HIGH-LOW PULSE tW HIGH-LOW-HIGH PULSE 1.5V tREM 1.5V 3512 lnk 05 tSU tH PROPAGATION DELAY 3V 1.5V 0V VOH 1.5V VOL 3V 1.5V 0V 3512 lnk 06 ENABLE AND DISABLE TIMES ENABLE DISABLE 3V CONTROL INPUT tPZL OUTPUT NORMALLY LOW OUTPUT NORMALLY HIGH SWITCH CLOSED tPZH SWITCH OPEN 1.5V 0V 0V 3512 lnk 07 SAME PHASE INPUT TRANSITION tPLH OUTPUT tPLH OPPOSITE PHASE INPUT TRANSITION tPHL tPHL tPLZ 3.5V 1.5V tPHZ 0.3V 1.5V 0V 3.5V 0.3V VOL VOH NOTES: 1. Diagram shown for input Control Enable-LOW and input Control DisableHIGH 2. Pulse Generator for All Pulses: Rate 1.0MHz; tF 2.5ns; tR 2.5ns 5 IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE ORDERING INFORMATION IDT XX FST 16 XX Temp. Range Device Type X Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 163233 16-Bit 2:1 Mux/Demux Switch 74 -40C to +85C 3512 drw 08 Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product. Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA 95054-3090 6 Telephone: (408) 727-6116 FAX 408-492-8674 |
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